Packaging solutions business Nordson gears-up for Interpack showcase

German-headquartered Nordson packaging solutions business is set to offer its latest iteration of adhesive technologies at this year’s interpack, writes Neill Barston.

The company noted that it will unveil a new line of ‘smarter, more efficient and more sustainable solutions for modern packaging lines’ at this year’s key cross-industry event.

More than 2,800 businesses from across industries, including a significant presence with confectionery, snacks, and bakery machinery lines will be exhibiting at this year’s event in Dusseldorf Messe, between 7-13 May at Hall 11, booth F26. 

As the business noted, it will demonstrate how its next-generation systems help manufacturers optimise uptime, improve bonding quality, and reduce material consumption across a wide range of packaging applications.

Nordson is gearing up to inspire the packaging world at interpack 2026 with a dynamic showcase of its newest hot melt adhesive technologies—engineered to empower manufacturers to run smarter, faster, and more sustainably. Visitors can expect a powerful mix of innovation, hands‑on experiences, and future‑focused insights as Nordson brings its next generation of solutions to Düsseldorf.

As the firm noted, it has engaged with a wide array of sectors, from confectionery manufacturing, through to pharmaceuticals, e‑commerce fulfilment, palletisation, or labelling markets. Its offerings are focused on reducing material usage to increasing uptime and improving bonding reliability.

To bring these innovations to life, Nordson will host live demonstrations every morning and afternoon throughout the event. A standout moment of the week will take place on Saturday, May 9, at 11:20 a.m., when Nordson takes the stage at the interpack Spotlight Forum.

As the business added, the presentation will cover how smart adhesive application significantly enhances efficiency, process control, and sustainability in advanced packaging operations. Innovative technologies will be showcased, such as methods to avoid thermal stress on adhesive material, as well as solutions for reducing material consumption, minimising unplanned downtime, and meeting the highest quality standards.