Italian Ipack-Ima packaging and processing events appoint new chairman

Organisers of the Ipack-Ima events have named Valerio Soli as chairman of the trade fairs, which are a joint venture between Italian packaging organisation Ucima and Fiera Milano.

The next shows are due to take place in Milan between 4-7 May 2021, and will build on the previous showcases in delivering a broad range of industry innovations.

Among the core goals of the events is ensuring their international reach and coverage of the entire supply chain, including process and packaging solutions, packaging materials and end-of-line technologies.

Taking the helm for these shows, Soli will draw upon his many years of experience as CEO working at Coesia Group, which includes member companies Acma, Gdm, Ipi and Systems Ceramics, covering  all stages of the food and non-food industries.

Soli said: “I am delighted to have been appointed chairman of Ipack Ima srl, a leading organiser of international processing and packaging exhibitions,” said Valerio Soli. “In taking on this new role I am committed to sharing my experience in the organisation of the many projects we are working on for the 2021 shows and in developing sustainable strategies for the future.

“Markets are evolving rapidly and continuously in response to new needs and consumer behaviours, so we must understand these trends and anticipate change so as to surprise and impress our customers. International presence, the digital world, technological innovation and environmental sustainability will be our main goals.”.

“Digitalisation, circular economy and research will be the keywords of the 2021 editions of Ipack-Ima and Meat-Tech,” explained CEO Rossano Bozzi.

“With their strong focus on ideas, the exhibitions will give entrepreneurs, managers and technicians from all over the world a chance to discover the most innovative solutions for production and packaging and for the end-of-line stage, labelling and traceability, while promoting the diffusion of flexible and increasingly customised applications.”

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